Archgen Labs builds AI-powered chip design tools for the next generation of 3D semiconductors.

Stacking compute vertically shortens connections and reduces the energy and delay of moving data. But it also makes heat harder to remove. Our tools help engineers optimize placement, timing, and temperature together so they can build faster, more power-efficient 3D chips.

Our GPU-accelerated placement engine ranked first in the Hudson River Trading macro-placement challenge. LayerTherm, our thermal analysis tool, predicts chip temperatures roughly 5,000× faster than conventional simulation in

Hardware · Semiconductors · AI

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